Yu Zhou; Jintang Shang; Yu Ji; Li Zhang; Chiming Lai; Dong Chen; Kim-Hui Chen; Ching-Ping Wong, A novel molding process for wafer level LED packaging using uniform micro glass bubble arrays, Electronic Components and Technology Conference (ECTC), 2014 IEE
作者:Yu Zhou; Jintang Shang; Yu Ji; Li Zhang; Chiming Lai; Dong Chen; Kim-Hui Chen; Ching-Ping Wong 发表日期:2014-03-03

Yu Zhou; Jintang Shang; Yu Ji; Li Zhang; Chiming Lai; Dong Chen; Kim-Hui Chen; Ching-Ping Wong,

A novel molding process for wafer level LED packaging using uniform micro glass bubble arrays,

Electronic Components and Technology Conference (ECTC), 2014 IEEE 64th, DOI: 10.1109/ECTC. 2014. 6897626, IEEE

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